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SoC Module with Xilinx Zynq 7020-1C, 256 MByte DDR3 SDRAM, 4 x 5 cm

Key Features

Xilinx Zynq XC7Z020-1CLG484C
Rugged for high shock and vibration
ARM dual-core Cortex-A9 MPCore
256 MByte DDR3 SDRAM
32 MByte QSPI Flash memory
10/100/1000 tri-speed Gigabit Ethernet transceiver (PHY), SGMII accessible on a board-to-board connector
USB 2.0 high-speed ULPI transceiver
Plug-on module with 2 x 100-pin and 1 x 60-pin Razor Beam High-Speed hermaphroditic Terminal/Socket Strips (regular 4 mm)
152 FPGA I/O’s (75 LVDS pairs possible) and 14 MIO’s available on board-to-board connectors
On-board high-efficiency DC-DC converters
    ▷ 4.0 A x 1.0V power rail
    ▷ 3.0 A x 1.5V power rail
    ▷ 3.0 A x 1.8V power rail
System management and power sequencing
eFUSE bit-stream encryption
AES bit-stream encryption
Valid MAC Address and 2K serial EEPROM
SHA-256 authentication chip with a unique serial number
RTC, temperature compensated
3 user LEDs
Evenly spread supply pins for good signal integrity
Other assembly options for cost or performance optimization plus high volume prices are available on request.
Depending on the customer’s design, additional cooling might be required.

Development Support

There are different baseboards available for this module. The latest documentation, design support files, and reference designs with source files are available for download free of charge.

Scope of Delivery

1 x TE0720-04-61C530A Trenz Electronic 4 x 5 cm SoC module with Xilinx Zynq-7020
8 x screws
4 x bolts

For more product info, please visit:
For price inquiry and delivery info, please contact:

MaxCom Global Inc​.


4605 Boulevard Lapinière, Suite 350,
Brossard, QC, J4Z 3T5

​Japan office

2-3 Sakuragicho, Omiya-ku, Saitama City, Saitama Prefecture, 330-9501

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