Key Features

Xilinx Zynq UltraScale+ XCZU7EV-1FBVB900E
ZU7EV 900 Pin Packages
3 mm mounting holes for skyline heat spreader
Size: 52 x 76 mm
B2B Connectors: 4 x 160 pin
Rugged for shock and high vibration
4 GByte DDR4 SDRAM
128 MByte SPI Boot Flash (dual parallel)
User I/Os
    ▷ 65 x PS MIOs, 48 x PL HD GPIOs, 156 x PL HP GIPIOs (3 banks)
    ▷ Serial transceivers: 4 x GTR + 16 x GTH
    ▷ Transceiver clocks inputs and outputs
    ▷ PLL clock generator inputs and outputs
Graphic Processing Unit (GPU) + Video codec unit (VCU)
Si5345 – 10 output PLL
All power supplies on board, single 3.3V Power required
    ▷ 14 on-board DC/DC regulators and 13 LDOs
    ▷ LP, FP, and PL separately controlled power domains
Support for all boot modes (except NAND)
Support for any combination of PS-connected peripherals
Evenly spread supply pins for good signal integrity
Other assembly options for cost or performance optimization plus high volume prices are available on request.

Development Support

There is a baseboard available for this module.
The latest documentation, design support files, and reference designs with source files are available for download free of charge.

Scope of Delivery

1 x TE0807-03-7DE21-A Trenz Electronic MPSoC module with Xilinx Zynq UltraScale+ ZU7EV
1 x mounted heat spreader for TE0807 (article no. KK0807-02A)

For more product info, please visit: https://www.trenz-electronic.de
For price inquiry and delivery info, please contact: sales@maxcomglobal.ca