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MPSoC Module with Zynq UltraScale+ ZU17EG-2E, 4 GB DDR4 (PS), 4 GB DDR4 (PL)

Key Features

Xilinx Zynq UltraScale+ XCZU17EG-2FFVC1760E
ZU17EG, C1760 Pin Packages
Rugged for shock and high vibration
Graphics Processing Unit (GPU): Mali-400 MP2
Plug-on module with 4 x Samtec ADM6 board-to-board connectors
4 GByte (64-bit) DDR4 SDRAM with ECC on PS
4 GByte (64-bit) DDR4 SDRAM on PL
256 MByte QSPI boot Flash
8 GByte e.MMC
1 x Gigabit Ethernet transceiver PHY
USB2.0 PHY
Total I/O: 370
Gigabit transceivers: 32 x GTH, 16 x GTY, 4 x GTR
EEPROM with MAC
System controller (Intel MAX 10)
All power supplies on board, 12V single supply
Evenly spread supply pins for good signal integrity
Dimensions: 7.5 x 10 cm form factor
Other assembly options for cost or performance optimization plus high volume prices are available on request.

Development Support

The latest documentation, design support files, and reference designs with source files are available for download free of charge.

Scope of Delivery

1 x TE0865-02-DGE23MA Trenz Electronic MPSoC module with Xilinx Zynq UltraScale+ ZU17EG

For more product info, please visit: https://www.trenz-electronic.de
For price inquiry and delivery info, please contact: sales@maxcomglobal.ca

MaxCom Global Inc​.

CANADA OFFICE

+1-450-800-0156
info@maxcomglobal.ca​
2300 Tupper St Montreal, QC H3H 0B9

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+81-70-8539-4023​
info@maxcomglobal.ca​
2-3 Sakuragicho, Omiya-ku, Saitama City, Saitama Prefecture, 330-9501

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